Real time Laue CCD camera system for single and bulk crystal orientation
The single crystal Laue
Orientation Tool uses a unique back scattered detector geometry and provides
real time alignment facilities down to +/-0.02 degree accuracy. Configured for small
crystals (horizontal setup) or bulk crystals / wafers (vertical setup), the
system also allows mapping, scanning routines for texture analysis on
The Turnkey Digital Laue detector allows high throughput crystal characterisation
with automatic sample positioning. Adaptors for saw cutting, for easy transfer of single crystals from the Laue system to a wire saw available.
The system enables real time crystal orientation by recording live digital backscattered LAUE diffraction patterns.
It allows very fine crystal alignment down to 0.2 degree accuracy using our standard Laue orientation tool.
0.02 degree misalignment can be measured using our microdiffraction set up.
Combined with motorised single crystal rotation / translation, the system brings simpler and more flexible ingot and raw crystal orientation routines before and after cutting / slicing procedures.
The system is delivered with a user friendly graphical user interface which will index diffraction patterns from known crystal structures.
An automatic software routine will derive orientation / misalignment of sapphire, silicon, YAG and other materials which undergo high throughput production.
The system comes as a tunrkey solution or as an upgrade to existing Polaroid Laue set up.
Real-time Crystal Orientation down to 0.2 degree
Misalignment measurement down to 0.02 degree
Laue Indexation software
Turnkey solution, custom upgrade for existing system
In the last few years
a whole new waveband of the electromagnetic spectrum has been opened up for
exploitation: the Short Wave Infra Red (SWIR). The band runs from the edge of
the near IR region at 900 nm up to 1700 nm, and has traditionally been invisible
to all detectors. Now, Indium Gallium Arsenide sensors can image within this
waveband, for a wide range of applications. For example, solar cells can be
made to emit in this waveband, allowing in-line inspection of their internal
structure during manufacture. Bruising of fruit can be detected by imaging the
sub-surface accumulation of water. Surveillance applications can benefit from
reduced atmospheric scattering due to mist in the SWIR band, and can take
advantage of the SWIR band “night glow” of a clear night sky. SWIR band laser
illuminators, invisible to most detectors, can provide high quality night
vision when coupled with a SWIR camera.
Silicon wafer inspection with laser induced photoluminescence
Solar cell / bare wafer photoluminescence inspection system
Photoluminescence (PL) performs non contact testing of PV cells and
wafers by using a laser source. PL images are captured with a cooled
InGaAs camera within 100ms exposure depending on source power used. PL
imaging (proportional to minority carrier life time which correlates
with cell efficiency) can be performed at any point of solar cell
processing (bare wafer, wafer with oxide or nitride, patterned finished
The on line testing solution is capable of very high throughput up to 3,600 wafers / cells per hour.
Intuitive software detects micro cracks, shunts, hot spots and low efficiency areas
Bare wafer in line inspection
Processed cell in line inspection
Finished panel inspection (installed panels / prior to installation)
Silicon wafer photoluminescence
Solar cell photoluminescence
New visible 15 microns SWIR camera delivers low read out noise
Photonic Science introducing 640x512 extremely low noise SWIR InGaAs camera with visible extension.
(datasheet at the foot of this page)
introducing the cooled Vis-SWIR InGaAs camera with an extended spectral range
in visible spectrum. The camera is capable of operating fron 400nm to 1700nm
allowing detection in visible and short infrared region simultaneously with
peak quantum efficiency above 80%. With 640x512 pixels resolution and 15
microns pixel size, this camera is very well suited for 2/3inch format lenses
and microscopy objectives used for semiconductor inspection, photoluminescence
measurements and hyperspectral imaging.
comes with an option of either air cooled or water cooled. In addition to
python based PSL software.
offer labview VIs or SDK/DLL kit for user to generate their own interface. OEM
version with special form factors/cooling options are available for integration
into specific instruments / systems.
50 electron read out noise
Operating spectral range of 400nm to 1700nm
16-bit dynamic range
New cooled 640 x 512 InGaAs camera for quantitative SWIR imaging and spectroscopy
Genicam compliant cooled SWIR camera
PSL is introducing Genicam SWIR cameras complying with industrial Gigabit Ethernet Vision (GEV) standards. The cameras can be operated with open source software like Pleora, JAI tools etc. Compliance with GEV standards allows operation with multiple platforms (Windows, Linux) and available GEV compliant SDKs.
OEM versions with special forms factors / cooling options are available for integration into specific instruments / systems.
SWIR Imaging at 110 Hz full resolution
Single-tap camera delivers 110 fps. ROI of 320 140 pixels allows frame rate at up to 200 fps.
Smaller ROI will increase the frame rate up to 9.5 KHz with a single line.
Single tap delivers stable offset / non uniformity correction for consistend acquisition routines.
Range of cooled SWIR available
Standard 1/4 VGA (320 x 256) 900nm to 1700 nm
Extended VGA (640 x 512) 1200nm to 2200nm
Standard VGA (640 x 512) 900nm to 1700nm
Vis-SWIR VGA (640 x 512) 400nm to 1700nm
laser beam profiling
Cooled high sensitivity InGaAs camera with 640x512 resolution
Vis-SWIR camera operates in spectral range of 400nm to 1700nm allowing
detection in visible and near infrared spectrum simultaneously with
high quantum efficiency.
camera offers high sensitivity and very good signal to noise ration,
thanks to a 50 electrons read out noise VGA format (640 x 512 pixels)
Very High Resolution camera systems for X-ray radiography and X-ray tomography applications
Very High Resolution X-ray sCMOS and CCD Systems
Computed Radiography System
The system replaces conventional high resolution films used for bone densitometry and other biopsy diagnostic techniques.
It allows acquisition of high resolution sections down to micrometer resolution. Multiple fields of view are automatically scanned and stitched in order to produce images of large samples / biopsy sections.
The camera is calibrated against known Hydroxyapatite response in order to deliver quantitative results.
The system includes 11 megapixel CCD detector and produces images of nearly 100 megapixel resolution with 3x3 reconstructed images.
The resulting image covers 21mm x 14mm filed of view with less than 2 micron pixel size.
4 and 11 Megapixel resolution camera
Bone cut four fields unstitched
Bone cut four fields stitched
Computed Tomography camera system
The system comes as a turnkey computed tomography acquisition solution which delivers data ready for 3D reconstruction at low kV range, typically 20 to 90kV.
It includes a microfocus source with various anode materials, cooled X-ray camera and high precision rotation stage within a small footprint X-ray cabinet.
This 3D microCT platform is a cost effective system available with 1.4 megapixel up to 11 Megapixel X-ray camera.
The cameras offers very high sensitivity thanks to fibre optic coupling and very high resolution down to 10 microns without magnification.
A very high sensitivity 4 Megapixel sCMOS camera is available for low dose applications. It enables single X-ray quantum detection with frame rates in excess of 30fps.
Acquisition software enables real time acquisition against reference samples with flat field & geometric corrections prior to carry out 3D reconstruction.
X-ray Microfocus source
1.4 - 4 and 11 Megapixel resolution camera
Motorized rotation / translation stages
3D MicroCT Platform
3D reconstructed rough diamond, 2 micron resolution
By Photonic Science on Monday, March 9 2009, 16:09
High resolution Laue Neutron & X-ray imaging system — the dual camera system allows a digital backscattered Laue diffraction pattern to be recorded, with a resolution of 2080x1392 pixels and 12-bit digitisation at 10MHz. The X-ray beam passes through the camera in a straight lead lined tube of 16mm diameter, to protect the camera system from scattered X-rays.
The image areas allow some overlap to permit image stitching and provide a single continuous image with an input dimension of 156mm x 104.4mm. The system is supplied in a unified housing with mounting plate. The x-ray scintillator screen is GdOS:Tb 0.1mm thick with a peak emission at 550nm to match peak QE response of the CCD. Other scintillators are available to order.
The input scintillator is covered by a thin aluminium light exclusion window. The camera features a variety of functions such as binning, sub area readout and 16 bit acquisition mode, which apply to the single combined image.